Bisphenol A based epoxy resin.
Bisphenol A based epoxy resin diluted with C12-C14 .
Optimized version of CET 8020 designed to provide enhanced resistance against crystallization during storage.
Bisphenol-A based epoxy resin with low viscosity and crystallization resistance.
CET 523 is designed to provide improved flexibility and toughness.
Epoxy resin solution dissolved in xylene.
Bisphenol F based epoxy resin.
A low-viscosity, crystallization-resistant epoxy resin based on bisphenol-A/F diluted with reactive diluent.
Bisphenol-A and Bisphenol-F based epoxy resin modified with a reactive diluent that improves the chemical and thermal resistance
Bisphenol-A and Bisphenol-F based epoxy resin offers improved chemical resistance and higher crosslink density
Bisphenol A and bisphenol F based epoxy resin
Designed for aplication requiring high chemical resistance epoxy resin.
80% solution of epoxy phenol novoalc (3.6 f) in methyl ethyl ketone.
Solid epoxy resin with a bromination, specifically designed for applications that demand high degree of flammability resistance epoxy resin.
Primarily used in protective coatings, laminating, and adhesive epoxy resin.
C12-C14 Alkyl Glycidyl Ether
1,4-Butandiol Diglycidyl Ether
Low-viscosity, modified, cycloaliphatic polyamine hardener.
Suitable for use on wet sufaces.
Polyoxypropylenetriamine is a trifunctional primary amine used primarily in epoxy resins.
Polyoxypropylenediamine is one of a family of polyamines having as their backbones repeated oxypropylene units.
High viscosity curing agent designed for use with solid or solvent based liquid epoxy resins.
Polyamide curing agent for epoxy systems.CETAMIDE 221X70 is TETA free.
Standard polyamide curing agent for epoxy systems.
